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| December 20, 2006 |
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| Nagase's Subsidiary Establishes Semiconductor-related Base in Southeast Asia | |||||||||||||||||||||||||||||||||||
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In order to reinforce the production of its semiconductor manufacturing equipment and its wafer bumping services in Asia, Pac Tech-Packaging Technologies GmbH, a subsidiary of Nagase & Co., Ltd. (the Company), has established Pac Tech Asia Sdn.Bhd. in Penang, Malaysia. [Background] Pac Tech-Packaging Technologies GmbH is engaged in the sales of semiconductor manufacturing equipment and outsourced processing of wafers primarily in the European and U.S. semiconductor industry. The Company is responsible for the sales of said equipment and wafer bumping services of Pac Tech-Packaging Technologies GmbH in Japan. As a vast number of the Company's and Pac Tech-Packaging Technologies' user groups are located in Southeast Asia, the establishment of a Southeast Asian base had been a foremost task for the entire Group. In consideration of the abundance of human resources, the existence of sufficient infrastructure, and consequently the suitability of the locale to production, the Group has decided to build its plant in Malaysia with a view to increasing its production capacity and enhancing its competitive edge. [Future Policies] A total of approximately 5 million euros in investments is planned for this plant, including a capital increase in FY 2007. Plans are also underway to commence the production of semiconductor manufacturing equipment in the first quarter of FY 2007, while a plating line for wafer processing is scheduled for launch by the third quarter. This current investment is expected to enable the plant, with a floor area of approximately 40,000 m2, to engage in wafer bumping services with a processing capacity of 600,000 per year. The Company's future policy will be to consider additional investments, as it keeps an eye on the expansion of the market. The current foray into Malaysia signifies the formation of a Japan-U.S.-Europe-Asia quadrilateral structure for the Company and Pac Tech-Packaging Technologies which already have bases established in Japan, Germany and the U.S. By utilizing these four geographical bases, in addition to the "Semiconductor Applications Development Center," which opened in Kyushu in November of this year, the Company intends to promote the development of the ever-changing semiconductor-related business in the priority area of electronics.
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